China’s Chip Bosses Aim to Create ‘China’s ASML’: What It Means for Global Semiconductor Investors
BEIJING — Senior Chinese semiconductor leaders have called for a coordinated national initiative to develop operational lithography systems between 2026 and 2030, highlighting China’s strategic drive for greater technological self-reliance.
Zhao Jinrong, chairman of Naura Technology Group; Chen Nanxiang, chairman and president of Yangtze Memory Technologies Corp; and Liu Weiping, chairman of Empyrean Technology, jointly authored a call in an article published online Wednesday alongside prominent semiconductor institutions. They urged the government to consolidate national resources and enhance integration of technological advances across organizations.
Since 2020, semiconductor manufacturing has become a crucial front in the China–U.S. technology rivalry, with Washington imposing restrictions to curb China’s ability to expand cutting-edge production capabilities below 7 nanometres.
The executives highlighted the complexity of lithography machines, noting that ASML’s extreme ultraviolet (EUV) systems contain 100,000 components sourced from 5,000 suppliers, with ASML acting as the system integrator. ASML Holding, a Dutch company, remains the world’s sole supplier of EUV lithography machines essential for manufacturing the most advanced chips used in smartphones, artificial intelligence, and high-performance computing.
The article, published in Science and Technology Review—a journal linked to China’s science and technology professionals association—stressed the urgent need for China to develop its own ASML-equivalent, recommending immediate government plans to allocate funding and human resources efficiently.
China has made advances in key components such as EUV laser light sources, wafer stages, and optical systems. However, the integration of these elements into a complete lithography system remains a significant challenge to be addressed within the 15th five-year plan period (2026–2030).
The authors also identified bottlenecks in electronic design automation (EDA) software and foundational materials like silicon wafers and electronic gases, calling for national-level coordination to overcome these obstacles.
In its latest government work report released Thursday, China designated semiconductors alongside aviation, biotechnology, and the low-altitude economy as core pillars of emerging industries. Premier Li Qiang emphasized breakthroughs in domestically driven chip research and development.
While the five-year roadmap did not explicitly mention lithography machines, it prioritized enhancing advanced process manufacturing capabilities and accelerating development of key equipment, materials, and components.
China’s chip production capacity at the mature 28-nanometre node and above constitutes 33% of global capacity and remains free from manufacturing and design restrictions, according to the Science and Technology Review article.
The authors also recommended establishing public platforms with advanced process capabilities to support research, development, and validation of new device structures, process equipment, components, materials, and EDA software.
Special Analysis by Omanet | Navigate Oman’s Market
China’s intensified focus on developing indigenous lithography systems amid US tech restrictions signals a strategic push for semiconductor self-reliance, which could disrupt global supply chains. For Oman’s businesses, this underscores the importance of diversifying tech investments and forging partnerships in emerging semiconductor and advanced manufacturing sectors. Smart investors should monitor China’s progress closely, as accelerating semiconductor innovation may reshape regional technology ecosystems and open new opportunities for tech-driven growth.
